Semiconductor Wafer Grinding Machine for Precision Thickness

Semiconductor Wafer Grinding Machine for Precision Thickness
  • Semiconductor Wafer Grinding Machine for Precision Thickness

    • Semiconductor Wafer Grinding Machine for Precision Thickness

    Request a Quote
    typeDouble Side Lapping Machinevoltage380 V
    cnc or notCNCcore componentsPLC
    machinery test reportProvidedvideo outgoing-inspectionProvided
    power (kw)5.5weight (kg)1800
    dimension(l*w*h)1700*1300*2170(mm)Machining AccuracyHigh Precision
    Applicable IndustriesGrinding IndustryInstallation MethodFloor-standing
    Grinding wheel speed3000(rpm)
    Get in Touch
    Contact Form Demo
    Other Products